Le Xuan-Bach | Advanced Simulation Techniques | Best Researcher Award

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Dr. Le Xuan-Bach | Advanced Simulation Techniques | Best Researcher Award

Postdoctoral at Seoul National University of Science and Technology in South Korea.

Le Xuan Bach is a leading researcher in advanced semiconductor packaging, specializing in fracture mechanics, thermo-mechanical reliability, and structural optimization. Currently serving as a Postdoctoral Researcher at the MEMS and Packaging System Lab, Seoul National University of Science and Technology, he has led multiple high-value, government-funded projects in Korea. His work combines deep theoretical insight with industrial application, focusing on preventing structural failures in semiconductor devices through cutting-edge simulation and optimization techniques. Dr. Bach’s research spans advanced packaging materials, hybrid bonding processes, and glass interposer technologies, addressing critical challenges in electronics manufacturing. His strong publication record in top-tier journals, combined with presentations at major international conferences, underscores his influence in the microelectronics community. With a forward-looking vision for integrating AI-based simulation methods into semiconductor reliability assessment, Dr. Bach continues to shape the future of microelectronics design and manufacturing through innovation, precision, and impactful collaborations.

Professional Profile

Google Scholar | Scopus

Education 

Le Xuan Bach earned his Ph.D. in Nano IT Design Fusion from Seoul National University of Science and Technology, where his dissertation focused on “Assessment and Prevention of Crack Formation in 2.5D Glass Interposer and Hybrid Bonding Structure.” His doctoral research integrated advanced finite element modeling, fracture mechanics, and thermo-mechanical simulations to tackle industrially significant packaging challenges. He previously obtained a Master of Science in Mechanical Engineering from Hanoi University of Science and Technology, completing a thesis on actuator properties of two-dimensional materials for robotic applications. His undergraduate studies in Mechanical Engineering at the same institution explored low-dimensional materials for artificial muscles. This academic progression reflects a strong foundation in mechanical systems, materials science, and computational simulation, enabling him to bridge fundamental research with real-world semiconductor reliability solutions. Each stage of his education has been characterized by innovation, interdisciplinary integration, and application-driven outcomes, forming the backbone of his current expertise.

Experience 

Le Xuan Bach’s professional journey blends academic research with industry-driven problem-solving. Currently, he is a Postdoctoral Researcher at Seoul National University of Science and Technology, specializing in structural and thermal analysis for advanced semiconductor packaging. Previously, he was a Research Student at the International Institute for Computational Science and Engineering in Vietnam, focusing on nanomechanics and stability analysis of 2D materials. His industry roles include collaborating with Maxflow Technology Vietnam on lifetime prediction and structural optimization, and working in product development at Showa Auto Parts Vietnam (2017–2018), where he contributed to mold design and flow simulation. He has served as Principal Researcher on multiple Korean national projects, overseeing large-scale grants for semiconductor reliability enhancement, laser debonding processes, and next-generation interposer development. His career reflects a rare balance between deep scientific inquiry and practical engineering solutions, with measurable impacts on microelectronics manufacturing efficiency and reliability.

Research Focus 

Le Xuan Bach’s research centers on advanced simulation techniques for semiconductor reliability, combining numerical analysis, finite element modeling, and optimization strategies to solve complex manufacturing challenges. His primary focus includes hybrid bonding reliability, prevention of crack formation in 2.5D/3D packaging, warpage-induced stress mitigation, and glass interposer structural integrity. He develops computational models that simulate thermo-mechanical and structural behaviors, enabling predictive lifetime assessment of microelectronic devices. His work extends to vibration analysis for gyroscope sensors, selective EMI shielding technologies, and optimization of laser-assisted bonding processes. Leveraging tools like ANSYS, ABAQUS, and COMSOL, Dr. Bach integrates simulation-driven design into industrial-scale production, improving both performance and durability. His forward vision includes incorporating AI and machine learning into simulation workflows, enabling adaptive, data-driven semiconductor packaging solutions that reduce failure rates, enhance manufacturability, and accelerate technology adoption in emerging electronics and IoT devices.

Publication Top Notes

Title: Assessment of the Risk of Crack Formation at a Hybrid Bonding Interface Using Numerical Analysis
Authors: Le, X. B., & Choa, S. H.
Summary: This study uses advanced finite element modeling to predict crack formation in hybrid bonding interfaces, a key challenge in next-generation semiconductor packaging. The simulation framework captures thermo-mechanical stress distributions with high precision, enabling proactive bonding parameter adjustments. This validated numerical approach reduces costly production failures and supports large-scale manufacturing reliability.

Title: A Comprehensive Numerical Analysis for Preventing Cracks in 2.5D Glass Interposer
Authors: Le, X. B., & Choa, S. H.
Summary: Focused on 2.5D packaging, this paper develops a simulation-driven strategy to predict and mitigate cracking in glass interposers. Through modeling complex temperature and stress cycles, it presents optimized annealing and structural designs that enhance stability and yield in semiconductor production.

Title: Mechanical Reliability Assessment of a Flexible Package Fabricated Using Laser-Assisted Bonding
Authors: Le, X. L., Le, X. B., Hwangbo, Y., Joo, J., Choi, G. M., Eom, Y. S., … & Choa, S. H.
Summary: This work assesses the reliability of flexible semiconductor packages fabricated with laser-assisted bonding. Using multiphysics simulations, it evaluates deformation and interfacial stresses, offering design guidelines to improve durability in wearable and foldable electronics.

Title: Electromechanical Properties of Monolayer Sn-Dichalcogenides
Authors: Bach, L. X., Van Thanh, V., Van Bao, H., Van Truong, D., & Hung, N. T.
Summary: Explores electromechanical properties of monolayer tin dichalcogenides using density functional theory. The results show strain-dependent behavior critical for NEMS applications.

Title: Turning Electronic and Optical Properties of Monolayer Janus Sn-Dichalcogenides by Biaxial Strain
Authors: Van Thanh, V., Dung, N. T., Bach, L. X., Van Truong, D., & Hung, N. T.
Summary: Investigates how biaxial strain alters the electronic and optical characteristics of Janus Sn-dichalcogenides. The study provides simulation-based design pathways for tunable optoelectronics.

Title: Strain Effects on Electronic and Optical Properties of Monolayer Mo-Dichalcogenides
Authors: Van Vuong, T., Nguyen, T. D., Le, X. B., Van, L. G., Van, B. H., Do Wang, T., & Tuan, H. N. 
Summary: Applies computational mechanics to analyze strain impacts on molybdenum dichalcogenide monolayers, revealing tunable band structures and optical absorption profiles for flexible electronics.

Conclusion

Le Xuan Bach presents a compelling case for recognition as a Best Researcher Award recipient. His leadership in high-value projects, consistent publication record, and direct contributions to advancing semiconductor packaging technologies underscore his standing as an accomplished and innovative researcher. With strategic expansion into more interdisciplinary and translational research avenues, his influence and impact are poised to grow even further, making him a highly deserving nominee for the award.

Chao Yang | Mechanical Engineering | Best Researcher Award

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Prof. Dr. Chao Yang | Mechanical Engineering | Best Researcher Award

Associate Professor, Jiaxing University, China.

Dr. Chao Yang, born in 1982, is currently a Lecturer in the School of Mechanical Engineering at Jiaxing University, China. He holds a Ph.D. in Mechanical Engineering from Zhejiang Sci-Tech University (2019), preceded by an M.E. in Engineering Mechanics from Dalian University of Technology (2009) and a B.E. in Process Equipment & Control Engineering from Zhengzhou University of Light Industry (2005). Since joining academia, Dr. Yang has consistently contributed to advancing the mechanics of parallel manipulators, focusing on kinematics, dynamics, stiffness analysis, and intelligent optimization algorithms. With over 20 peer-reviewed publications in reputable international journals and Awards, he has become a recognized figure in robot modeling and design. Dr. Yang also serves as a reviewer for journals like Mechanism and Machine Theory and Applied Mathematical Modelling, further reflecting his deep academic engagement. His work bridges theoretical innovation and practical engineering applications in robotics and precision mechanisms.

🧾Author Profile

🏆 Strengths for the Award

1. Deep Specialization in Parallel Manipulators

Dr. Yang’s research is highly focused and impactful in the domains of kinematics, stiffness modeling, dynamics, and optimization of parallel manipulators. His work addresses both theoretical foundations and practical design aspects, which are critical to modern robotics and automation systems.

2. Robust and Consistent Publication Record

Since 2018, Dr. Yang has published 20+ peer-reviewed articles, many in high-impact international journals such as:

  • Mechanism and Machine Theory

  • Mechanical Sciences

  • Chinese Journal of Mechanical Engineering

  • Robotica

  • International Journal of Control

3. Novel Contributions in Modeling Techniques

Dr. Yang has proposed and validated novel methodologies including:

  • Elastodynamic and elastostatic modeling of over-constrained systems

  • Use of neural networks and principal component analysis for multi-objective optimization

  • Finite-time tracking control techniques for underwater vehicles
    These show innovation, interdisciplinary thinking, and a mastery of mechanical system modeling.

4. International Journal Reviewership

Dr. Yang serves as a reviewer for journals like Applied Mathematical Modelling and Mechanism and Machine Theory, which reflects recognition of his expertise by the academic community.

🎓 Education 

Dr. Chao Yang began his academic journey in mechanical disciplines with a Bachelor’s degree in Process Equipment & Control Engineering from Zhengzhou University of Light Industry, China, in 2005. He continued to sharpen his analytical and mathematical expertise by completing his Master’s in Engineering Mechanics at Dalian University of Technology in 2009, where he laid the groundwork for his future in dynamic systems and mechanical modeling. In 2019, he earned his Ph.D. in Mechanical Engineering from Zhejiang Sci-Tech University, focusing on advanced dynamic analysis and optimization techniques for parallel robotic manipulators. His academic training integrates control theory, mechanical design, and computational modeling—making him uniquely positioned to tackle cutting-edge problems in modern robotics. This rich educational background directly contributes to his current research, which blends multi-body dynamics, elastostatics, and AI-based optimization in robotic mechanisms.

🔬 Research Focus On Mechanical Engineering

Dr. Chao Yang’s research focuses on the mechanics, modeling, and optimization of parallel manipulators—key elements in robotics and precision automation. His work revolves around four core themes: kinematics, stiffness modeling, dynamic analysis, and multi-objective optimization. He explores how over-constrained or hybrid manipulator systems can be optimized using neural networks, principal component analysis, and evolutionary algorithms. His innovative modeling methods extend to both elastostatic and elastodynamic domains, enabling more precise and adaptive control systems. He also delves into applications such as underwater robotics and hybrid robot platforms. By avoiding Lagrangian multipliers in modeling and adopting screw theory in kinetostatic design, he simplifies computational complexity while maintaining physical accuracy. His contributions fill a crucial gap in designing robust, high-performance robotic systems that are used in manufacturing, aerospace, and intelligent automation. Dr. Yang’s research is practical, interdisciplinary, and driven by the demands of next-generation robotics.

📚 Publications Top Notes

1. A hybrid algorithm for the dimensional synthesis of parallel manipulators

Journal: Proc. IMechE Part C: Journal of Mechanical Engineering Science, 2025
Authors: Yang, C.; Zhang, H.; Huang, F.; Ye, W.
Summary: This study presents a novel hybrid algorithm integrating evolutionary computing and deterministic search for optimizing the geometry of parallel manipulators. It addresses trade-offs in workspace, stiffness, and dexterity with improved computational performance.

2. Elastodynamic modeling and analysis of a 4SRRR overconstrained parallel robot

Journal: Mechanical Sciences, 2025
Authors: Wang, B.; Zhao, Y.; Yang, C.; Hu, X.; Zhao, Y.
Summary: Investigates vibration and dynamic response of a 4SRRR parallel robot. The study contributes to better understanding structural deformation under motion, crucial for high-speed precision applications.

3. Kinematic Analysis and Optimization Design of 2-PRU-PRRPa Parallel Mechanism

Journal: Transactions of the Chinese Society for Agricultural Machinery, 2025
Authors: Zhang, W.; Feng, S.; Yuan, X.; Sun, P.; Yang, C.; Lu, Y.
Summary: Offers a systematic study of a novel parallel mechanism applied in agricultural automation, optimizing motion paths and actuator placement.

4. Multibody elastodynamic modeling of parallel manipulators based on the Lagrangian equations without Lagrangian multipliers

Journal: Proc. IMechE Part C: Journal of Mechanical Engineering Science, 2025
Authors: Gong, Y.; Lou, J.; Yang, C.; Ye, W.
Summary: This paper introduces a novel elastodynamic modeling approach for parallel manipulators that bypasses the use of Lagrangian multipliers. The methodology improves numerical efficiency and simplifies model derivation, making it suitable for real-time control and simulation of complex parallel robotic systems.

5. Dynamic modeling and performance analysis of the 2PRU-PUU parallel mechanism

Journal: Mechanical Sciences, 2024
Authors: Sun, T.; Ye, W.; Yang, C.; Huang, F.
Summary: Focuses on the dynamic modeling of a 2PRU-PUU architecture parallel robot. Through simulation and performance metrics evaluation, the study demonstrates how structural configurations affect system response and highlights its suitability for precision tasks in constrained workspaces.

Conclusion

Dr. Chao Yang is highly suitable for the Research for Best Researcher Award—particularly in domains of mechanical systems design, parallel robots, and multi-objective optimization. His contributions are academically rich, technically deep, and steadily expanding. While early in his career stage as a lecturer, the maturity and depth of his publication portfolio, coupled with innovative methodologies, clearly reflect a rising star in mechanical engineering research.