Postdoctoral at Seoul National University of Science and Technology in South Korea.
Le Xuan Bach is a leading researcher in advanced semiconductor packaging, specializing in fracture mechanics, thermo-mechanical reliability, and structural optimization. Currently serving as a Postdoctoral Researcher at the MEMS and Packaging System Lab, Seoul National University of Science and Technology, he has led multiple high-value, government-funded projects in Korea. His work combines deep theoretical insight with industrial application, focusing on preventing structural failures in semiconductor devices through cutting-edge simulation and optimization techniques. Dr. Bach’s research spans advanced packaging materials, hybrid bonding processes, and glass interposer technologies, addressing critical challenges in electronics manufacturing. His strong publication record in top-tier journals, combined with presentations at major international conferences, underscores his influence in the microelectronics community. With a forward-looking vision for integrating AI-based simulation methods into semiconductor reliability assessment, Dr. Bach continues to shape the future of microelectronics design and manufacturing through innovation, precision, and impactful collaborations.
Professional Profile
Google Scholar | Scopus
Education
Le Xuan Bach earned his Ph.D. in Nano IT Design Fusion from Seoul National University of Science and Technology, where his dissertation focused on “Assessment and Prevention of Crack Formation in 2.5D Glass Interposer and Hybrid Bonding Structure.” His doctoral research integrated advanced finite element modeling, fracture mechanics, and thermo-mechanical simulations to tackle industrially significant packaging challenges. He previously obtained a Master of Science in Mechanical Engineering from Hanoi University of Science and Technology, completing a thesis on actuator properties of two-dimensional materials for robotic applications. His undergraduate studies in Mechanical Engineering at the same institution explored low-dimensional materials for artificial muscles. This academic progression reflects a strong foundation in mechanical systems, materials science, and computational simulation, enabling him to bridge fundamental research with real-world semiconductor reliability solutions. Each stage of his education has been characterized by innovation, interdisciplinary integration, and application-driven outcomes, forming the backbone of his current expertise.
Experience
Le Xuan Bach’s professional journey blends academic research with industry-driven problem-solving. Currently, he is a Postdoctoral Researcher at Seoul National University of Science and Technology, specializing in structural and thermal analysis for advanced semiconductor packaging. Previously, he was a Research Student at the International Institute for Computational Science and Engineering in Vietnam, focusing on nanomechanics and stability analysis of 2D materials. His industry roles include collaborating with Maxflow Technology Vietnam on lifetime prediction and structural optimization, and working in product development at Showa Auto Parts Vietnam (2017–2018), where he contributed to mold design and flow simulation. He has served as Principal Researcher on multiple Korean national projects, overseeing large-scale grants for semiconductor reliability enhancement, laser debonding processes, and next-generation interposer development. His career reflects a rare balance between deep scientific inquiry and practical engineering solutions, with measurable impacts on microelectronics manufacturing efficiency and reliability.
Research Focus
Le Xuan Bach’s research centers on advanced simulation techniques for semiconductor reliability, combining numerical analysis, finite element modeling, and optimization strategies to solve complex manufacturing challenges. His primary focus includes hybrid bonding reliability, prevention of crack formation in 2.5D/3D packaging, warpage-induced stress mitigation, and glass interposer structural integrity. He develops computational models that simulate thermo-mechanical and structural behaviors, enabling predictive lifetime assessment of microelectronic devices. His work extends to vibration analysis for gyroscope sensors, selective EMI shielding technologies, and optimization of laser-assisted bonding processes. Leveraging tools like ANSYS, ABAQUS, and COMSOL, Dr. Bach integrates simulation-driven design into industrial-scale production, improving both performance and durability. His forward vision includes incorporating AI and machine learning into simulation workflows, enabling adaptive, data-driven semiconductor packaging solutions that reduce failure rates, enhance manufacturability, and accelerate technology adoption in emerging electronics and IoT devices.
Publication Top Notes
Title: Assessment of the Risk of Crack Formation at a Hybrid Bonding Interface Using Numerical Analysis
Authors: Le, X. B., & Choa, S. H.
Summary: This study uses advanced finite element modeling to predict crack formation in hybrid bonding interfaces, a key challenge in next-generation semiconductor packaging. The simulation framework captures thermo-mechanical stress distributions with high precision, enabling proactive bonding parameter adjustments. This validated numerical approach reduces costly production failures and supports large-scale manufacturing reliability.
Title: A Comprehensive Numerical Analysis for Preventing Cracks in 2.5D Glass Interposer
Authors: Le, X. B., & Choa, S. H.
Summary: Focused on 2.5D packaging, this paper develops a simulation-driven strategy to predict and mitigate cracking in glass interposers. Through modeling complex temperature and stress cycles, it presents optimized annealing and structural designs that enhance stability and yield in semiconductor production.
Title: Mechanical Reliability Assessment of a Flexible Package Fabricated Using Laser-Assisted Bonding
Authors: Le, X. L., Le, X. B., Hwangbo, Y., Joo, J., Choi, G. M., Eom, Y. S., … & Choa, S. H.
Summary: This work assesses the reliability of flexible semiconductor packages fabricated with laser-assisted bonding. Using multiphysics simulations, it evaluates deformation and interfacial stresses, offering design guidelines to improve durability in wearable and foldable electronics.
Title: Electromechanical Properties of Monolayer Sn-Dichalcogenides
Authors: Bach, L. X., Van Thanh, V., Van Bao, H., Van Truong, D., & Hung, N. T.
Summary: Explores electromechanical properties of monolayer tin dichalcogenides using density functional theory. The results show strain-dependent behavior critical for NEMS applications.
Title: Turning Electronic and Optical Properties of Monolayer Janus Sn-Dichalcogenides by Biaxial Strain
Authors: Van Thanh, V., Dung, N. T., Bach, L. X., Van Truong, D., & Hung, N. T.
Summary: Investigates how biaxial strain alters the electronic and optical characteristics of Janus Sn-dichalcogenides. The study provides simulation-based design pathways for tunable optoelectronics.
Title: Strain Effects on Electronic and Optical Properties of Monolayer Mo-Dichalcogenides
Authors: Van Vuong, T., Nguyen, T. D., Le, X. B., Van, L. G., Van, B. H., Do Wang, T., & Tuan, H. N.
Summary: Applies computational mechanics to analyze strain impacts on molybdenum dichalcogenide monolayers, revealing tunable band structures and optical absorption profiles for flexible electronics.
Conclusion
Le Xuan Bach presents a compelling case for recognition as a Best Researcher Award recipient. His leadership in high-value projects, consistent publication record, and direct contributions to advancing semiconductor packaging technologies underscore his standing as an accomplished and innovative researcher. With strategic expansion into more interdisciplinary and translational research avenues, his influence and impact are poised to grow even further, making him a highly deserving nominee for the award.
